Materials exhibit significant creep behavior at temperatures above 40% of their absolute melt temperature. Lead, tin and their alloys are such materials which experience significant creep behavior in room temperature. One of the most important applications of the tin-lead alloys is soldering electronic circuits in electronic industry, and for lead are isolation walls and wet batteries. Room temperature for lead is about 50% and for tin70%-lead30% is about 63% of their absolute melting temperature, and considering creep damage during their structural design is of prime importance. In this paper, creep and creep rupture data of these two materials are investigated experimentally. Diagrams obtained from experiment in the applied form, are presented for the application in computer simulation and forecasting connections life cycle. Creep rupture diagrams in the form of time hardening in the creep primary stage are presented to give strain-time relation and Larson-miller and Monkam-Grant parameters. The steady state creep rate relation for both materials in terms of stress function is also provided.