Micheli, L., Reddy, K. S., and Mallick, T. K., Experimental Comparison of Micro-Scaled Plate-Fins and Pin-Fins Under Natural Convection, International Communications in Heat and Mass Transfer, Vol. 75, 2016, pp. 59-66.
 Costello, S., Demulliez, M., Assembly, Packaging and Environmentally Induced Failures, Hermeticity Testing of MEMS and Microelectronic Packages, Artech House, 2013.
 Khanna, P., Bhatnagar, S., and Gust, W., Analysis of Packaging and Sealing Techniques for Microelectronic Modules and Recent Advances, Microelectronics International, Vol. 16, No. 2, 1999, pp. 8-12.
 Goldmann, L., Howard, R., and Jeannotte, D., Package Reliability, Microelectronics Packaging Handbook, Springer, 1997.
 Wong, C., Clegg, D., Kumar, A., Ostsuka, K., and Ozmat, B., Package Sealing and Encapsulation Microelectronics Packaging Handbook, Springer, 1997.
 Ibitayo, O., Evaluation of Various Die-Attachment Materials and Processes for Power Electronics Packaging, Howard University, 2008.
 Masuko, T., Takeda, S., Die Attach Adhesive and Films, Materials for Advanced Packaging, Springer, Boston, MA, 2009.
 Shanmugan, S., Mutharasu, D., and Lee, Z. Y., Surface and Electrical Properties of Plasma Processed RF Sputtered GaN thin Film, European Physical Journal of Applied Physics, 68, 2014, 30303, DOI: 10.1051/epjap/2014140225.
 Jain, P., Zhou, P., Kim, C. H., and Sapatnekar, S., Thermal and Power Delivery Challenges In 3d Ics, From Book Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures
, 2009, pp. 33-61.
 Poulikakos, D., Bejan, A., Fin Geometry for Minimum Entropy Generation in Forced Convection, Journal of Heat Transfer, Vol. 104, No. 4, 1982, pp. 616-623.
 Culham, J. R., Muzychka, Y. S., Optimization of Plate Fin Heat Sinks Using Entropy Generation Minimization, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, 2001, pp. 159-165.
 Feng, S., Shi, M., Yan, H., Sun, S., Li, F., and Lu, T. J., Natural Convection in a Cross-Fin Heat Sink, Applied Thermal Engineering, 132, 2018, pp. 30–37.
 Lee, M., Kim, H. J., and Kim, D. K., Nusselt Number Correlation for Natural Convection from Vertical Cylinders with Triangular Fins, Applied Thermal Engineering, Vol. 93, 2016, pp. 1238–1247.
 Joo, Y., Kim, S. J., Comparison of Thermal Performance Between Plate-Fin and Pin-Fin Heat Sinks in Natural Convection, International Journal of Heat Mass Transfer, Vol. 83, 2015, pp. 345–356.
 Wang, X. D., An, B., and Xu, J. L., Optimal Geometric Structure for Nanofluid-Cooled Micro Channel Heat Sink Under Various Constraint Conditions, Energy Conversion Management, Vol. 65, 2013, pp. 528–538.
 Keshavarz Moraveji, M., Mohammadi Ardehali, R., and Ijam, A., cfd Investigation of Nanofluid Effects (Cooling Performance and Pressure Drop) In Mini-Channel Heat Sink, International Communication in Heat Mass Transfer, Vol. 40, 1, 2013, pp. 58–66.
 Saeed, M., Kim, M. H., Numerical Study On Thermal Hydraulic Performance of Water Cooled Minichannel Heat Sinks, International Journal of Refrigeration, Vol. 69, 2016, pp. 147–164.
 Yogeva, R., Kribus, A., PCM Storage System with Integrated Active Heat Pipe, Energy Procedia, Vol. 49, 2014, pp. 1061–1070.
 Ameni, D., Samah, M., and Mohamed, C. Z., Experimentation and Modeling of the Steady State and Transient Thermal Performances of a Helicoidally Grooved Cylindrical Heat Pipe, Microelectronic Reliability, Vol. 62, 2016, pp. 102–112.
 Meinders, E., Van Der Meer, T., and Hanjalic, K., Local Convective Heat Transfer from an Array of Wall-Mounted Cubes, International Journal of Heat Mass Transfer, Vol. 41, 2, 1998, pp. 335–346.
 Lorenz, S., Mukomilow, D., and Leiner, W., Distribution of the Heat Transfer Coefficient in A Channel with Periodic Transverse Grooves, Experimental Thermal Fluid Science, Vol. 11, No. 3, 1995, pp. 234–242.
 Junaidi, M. A. R., Rao, R., Sadaq, S. I., and Ansari, M. M., Thermal Analysis of Splayed Pin Fin Heat Sink, International Journal of Modern Communication, Technological Research, IJMCTR, Vol. 2, No. 4, 2014.
 Anusha, I. L., Murali, S., Rao, P. S., and Padmavathi, P., CFD Analysis of Splayed Pin Fin Heat Sink Using Advanced Composite Materials, International Conference of Advance Mechanical Science, 2014, pp. 493–495.
 Khan, W. A., Culham, J. R., and Yovanovich, M. M., Optimization of Pin-Fin Heat Sinks Using Entropy Generation Minimization, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 2, 2005, pp. 247-254.
 Hamadneh, N., Khan, W. A., Sathasivam, S., and Ong, H. C., Design Optimization of Pin Fin Geometry Using Particle Swarm Optimization Algorithm, PloS one, Vol. 8, No. 5, 2013, pp. 66-80.
 Salwe, A., Bhagat, A. U., and Gabhane, M. G., Comparison of Forced Convective Heat Transfer Coefficient Between Solid Pin Fin and Perforated Pin Fin, International Journal of Engineering Research and General Science, Vol. 2, No. 3, 2014, pp. 2091-2730.
 Rao, G. V., Narayanaswami, R., Optimization of a Conducting Cooling Fin with A Heat Sink Using Optimality Criterion, International Journal of Solids and Structures, Vol. 14, No. 10, 1978, pp. 787-793.
 Razelos, P., Imre, K., The Optimum Dimensions of Circular Fins with Variable Thermal Parameters, Journal of Heat Transfer, Vol. 102, No. 3, 1980, pp. 420-425.
 Sparrow, E. M., Larson, E. D., Heat Transfer from Pin-Fins Situated in an Oncoming Longitudinal Flow Which Turns to Crossflow, International Journal of Heat and Mass Transfer, Vol. 25, No. 5, 1982, pp. 603-614, 5.
 Yeh, R., Liaw, S., Optimum Configuration of a Fin for Boiling Heat Transfer, Journal of the Franklin Institute, Vol. 330, No. 1, 1993, pp. 153-163.
 Sajedi, R., Taghilou, M., and Jafari, M., Experimental and Numerical Study On the Optimal Fin Numbering in an External Extended Finned Tube Heat Exchanger, Applied Thermal Engineering, Vol. 83, 2015, pp. 139-146, 5.
 Chin-Hsiang, C., Wen-Hsiung, H., Numerical Prediction for Laminar Forced Convection in Parallel-Plate Channels with Transverse Fin Arrays, International Journal of Heat and Mass Transfer, Vol. 34, No. 11, 1991, pp. 2739-2749.
 Fiebig, M., Embedded Vortices in Internal Flow: Heat Transfer and Pressure Loss Enhancement, International Journal of Heat Fluid Flow, Vol. 16, 1995, pp. 376–388.
 Torii, K., wak, K. M., and Nishino, K., Heat Transfer Enhancement Accompanying Pressure-Loss Reduction with Winglet-Type Vortex Generators for Fin-Tube Heat Exchangers, International Journal of Heat Mass Transfer, Vol. 45, 2002, pp. 3795–3801.
 Habchi, C., Russeil, S., Bougeard, D., Harion, J. L., Lemenand, T., and Della Valle, D., Enhancing Heat Transfer in Vortex Generator-Type Multifunctional Heat Exchangers, Applied Thermal Engineering, Vol. 38, 2012, pp. 14–25.
, M., Hajatzadeh Pordanjania
, A., Ahmadi Nadooshan,
A., and Shiryan Dehkordi
, K., Numerical Study of the Effects of Stator Boundary Conditions and Blade Geometry on the Efficiency of a Scraped Surface Heat Exchanger, Applied Thermal Engineering
, Vol. 113
, No. 25, 2017, pp. 1426-1436.
 Jahanbakhshi, A., Ahmadi Nadooshan, A., and Bayareh, M., Magnetic Field Effects on Natural Convection Flow of a Non-Newtonian Fluid in an L-Shaped Enclosure, Journal of Thermal Analysis and Calorimetry
, September 2018, Vol.133, No. 3
, pp. 1407–1416.
 Shirazi, M., Shateri, A., and Bayareh, M., Numerical Investigation of Mixed Convection Heat Transfer of a Nanofluid in a Circular Enclosure with a Rotating Inner Cylinder, Journal of Thermal Analysis and Calorimetry
, 2018, Vol. 133, No. 2
, pp. 1061–1073.
 Sepyani, M., Shateri, A., and Bayareh, M., Investigating the Mixed Convection Heat Transfer of a Nanofluid in a Square Chamber with a Rotating Blade, Journal of Thermal Analysis and Calorimetry
, 2019, Vol. 135, No. 1
, pp. 609–623.
 Bayareh, M., Nourbakhsh, A., and Khadivar, M. E., Numerical Simulation of Heat Transfer Over a Flat Plate with A Triangular Vortex Generator, International Journal of Heat and Technology, Vol. 36, No. 4, 2018, pp. 1493-1501.
, M., Kianfar
, A., and Kasaeipoor
, A., Mixed Convection Heat Transfer of Water-Alumina Nanofluid in an Inclined and Baffled C-Shaped Enclosure, Vol.5, No. 2
, 2018, pp. 129-138.
 Loh, C. K., Chou, D. J., Comparative Analysis of Heat Sink Pressure Drop Using Different Methodologies, 20th IEEE SEMI-THERM Symposium, 2004.